키사이트 공식대리점

F1 프로브 스테이션

F1 프로브 스테이션

  • 6,8,12인치 / 수동, 반자동, 전자동
  • F1+futureC+instrument를 선택구성
  • 1m 폭, 클린룸 비용을 절감, 이동편리
  • 실리콘 포토닉스 측정 가능
  • OO, OE, EO 및 EE테스트 지원
  • F1프로브스테이션의 핵심은 Future C 소프트웨이며 이 소프트웨어
  • 제어 시스템은 Keysight, Keithley, Rohde & Schwarz, Tektronix, NI, Anritsu 등 대부분의 장비들과 손쉽게 연동이 가능.
  • 모든 드라이버는 이미 Future C 소프트웨어에 내장.
  • 오픈형 시스템이 아닌 마이크로챔버 시스템
  • 누설전류(Leakage current) 및 노이즈 테스트에서 더 우수한 성능을 제공.
  • 세미오토(Semi-Auto)스테이션과 온도제어기능이 포함된 스테이션으로 업그레이드 가능
F1 Mechanical Performance
No. Item Chuck
X-axis Y-axis Z-axis Theta axis
1 Travel 301 mm 301 mm ≥ 10 mm 10°
2 Maximum positioning accuracy ≤ 0.05 μm ≤ 0.05 μm ≤ 1 μm ± 0.003°
3 Speed ≥ 50 mm/s ≥ 50 mm/s ≥ 20 mm/s /
4 Maximum speed 150 mm/s 150 mm/s 35 mm/s /
5 Wafer roughness adaptability 100 μm
6 Average time of mapping Minimum value Typical value Maximum value
< 500 ms < 1 s < 3 s
7 XY position locking Minimum value Typical value Maximum value
0.02 μm 0.038 μm 1.5 μm
8 Z position locking Minimum value Typical value Maximum value
0.65 μm 3.5 μm 15 μm
F1 Shielding Capability
No. Shielding and Noise Capability
1 Light attenuation ≥ 150 dB
2 EMI shielding ≥ 20 dB 0.5~20 GHz (typical)
3 Spectral noise floor ≤ -150 dBVrms/rtHz (≤ 1 MHz)
4 System AC noise ≤ 15 mVp-p (≤ 1 GHz)
5
 
F1 Vibration Isolation Capability
No. Vibration Isolation Capability
1 Natural frequency (vertical) 2.5 ~ 2.7 Hz
2 Natural frequency (horizontale) 2.0 ~ 4.5 Hz
3 Vertical damping (adjustable) 6% ~ 20%
4 Horizontal damping 5% ~ 6%
5 Air pressure 0.3 ~ 0.5 Mpa
6 Maximum load 1600 kg
7 Isolation efficiency 5% ~ 6%
8 Response time to external excitation < 1 s
9 Vibration isolation level VC-C
F1 Microscope
Microscope Bridge
No. Item X-axis Y-axis Z-axis /
1 Travel 50 mm 50 mm 90 mm /
2 Maximum positioning accuracy ± 2 μm ± 2 μm ± 2 μm /
3 Speed 60 mm/s 60 mm/s 120 mm/s /
Microscope
No. Item Large FOV High Resolution
4 Typical magnification 225 X 500 ~ 2000X or higher
5 Typical optical lens resolution 3.0 μm ≤ 1.5 μm
6 Product picture  
7 futureI image  
F1 Chuck
No. Item Chuck size
8-inch 12-inch
1 Temperature range Room temperature High and low temperature Room temperature High and low temperature
2 Maximum operating temperature range -60 ~ 300°C -60 ~ 300°C
3 Typical temperature range – 60 ~ 150°C
– 60 ~ 200°C
– 60 ~ 300°C
– 40 ~ 150°C
-40 ~ 200°C
-40 ~ 300°C
0 ~ 100°C
0 ~ 200°C
Room temperature ~ 150°C Room temperature ~ 200°C Room temperature ~ 300°C
– 60 ~ 150°C
– 60 ~ 200°C
– 60 ~ 300°C
– 40 ~ 150°C
-40 ~ 200°C
-40 ~ 300°C
0 ~ 100°C
0 ~ 200°C
Room temperature ~ 150°C Room temperature ~ 200°C Room temperature ~ 300°C
4 Temperature accuracy 8-inch 12-inch
5 Temperature resolution ± 1°C ± 1°C
6 Triax chuck leakage (non-thermal) 0.1°C 0.1°C
7 Triax chuck noise (non-thermal) ≤ 132 fA ≤ 231 fA
8 Cooling mode ≤ 30 fA ≤ 42 fA
9 Typical transition time
(Liquid cool)
– 60°C → 25°C:23 min
25°C → 300°C:28 min
300°C → 25°C:25 min
25°C → -60°C:37 min
– 60°C → 25°C:23 min
25°C → 300°C:28 min
300°C → 25°C:25 min
25°C → -60°C:37 min
10 Typical transition time
(Air cool)
– 60°C → 25°C:9 min
25°C → 300°C:25 min
300°C → 25°C:12 min
25°C → -60°C:29 min
– 60°C → 25°C:9 min
25°C → 300°C:25 min
300°C → 25°C:12 min
25°C → -60°C:29 min
11 Maximum heating power 5.5 kW
12 Maximum cooling power 12.5 kW
13 Maximum refrigerant flow 5 m/s
14 Maximum transport pressure 4 bar
15 Maximum voltage (high power option) 10000 V
16 Maximum current (high power option) 800 A
17 Usage statement l It shall be operated and stored strictly in accordance with the temperature and humidity specified in “Environmental conditions” in this Manual.
l Before the probe station leaves the factory, wafers shall be placed on chuck for performance verification and reliability test. Therefore, the scratches on the surface of chuck or the movable plate cannot be completely avoided. The scratches do not affect the use of the probe station and are not considered as a quality problem.
l Before the thermal probe station leaves the factory, heating and cooling test shall be conducted on the thermal system and thermal chuck. Therefore, the baking marks on the surface of the chuck (e.g. chuck color change and water vapor mark) cannot be completely avoided. The baking marks do not affect the use of the equipment and are not considered as a quality problem.
l When ambient temperature fluctuations occur, thermal expansion and contraction of equipment hardware constitutes a normal operational phenomenon.
l To ensure the reliability and consistency of test results, if the probe station remains continuously powered on and idle for 24 hours or longer, the user must perform system recalibration and reinitialize parameter settings.
l For high-precision, extended-duration (>6h) metrology of individual wafer, implementation of the Eoulu software application kit with associated service package is recommended.
l If ESD (Electrostatic Discharge) protection is required for the equipment, please explicitly state this before procurement. The F1 Probe Station provides ESD protection for key modules (Chuck, Robotic arm ). However, please note that ESD protection cannot be guaranteed for all components of the equipment. Certain materials and structures cannot achieve ESD protection through conventional processes. Forced modifications may lead to performance degradation, reduced service life, or significantly increased costs. Any equipment malfunctions resulting from such modifications will not be covered under the product warranty.
18 Safety statement This product is driven by 24 V DC motor, with an operating voltage level comparable to that of a personal computer (PC). It complies with the specifications for SELV (Safety Extra-Low Voltage) circuits as defined in IEC 61010-1 and meets the protection class against electric shock for Class III equipment as specified in IEC 61140. Based on this design, the Emergency Stop Device (EMO) or Electromagnetic Braking System (EMS) does not provide additional safety benefits.
Note: This statement does not affect other mechanical safety requirements that the equipment shall meet.
19 Cleaning l No items can be placed on the chuck except the device under test.
l If the screws are loose, promptly tighten them carefully and evenly according to the torque requirements. If necessary, contact the Eoulu’s after-sales team for treatment.
l For the fully-automated probe station, ensure that the power supply has been properly shut down during maintenance or when not in use, and ensure they do not accidentally restart before maintenance is completed or before use.
20 Maintenance l For probe station with a high utilization rate, it is recommended to conduct operational inspection and service of the chuck once a year.
l The following services can only be executed by Eoulu’s team:
1. Leveling and calibration of the chuck X/Y/Z/Theta stage
2. Disassembly and installation of the chuck
21 Service l For probe station with a high utilization rate, it is recommended to conduct operational inspection and service of the chuck once a year.
l The following services can only be executed by Eoulu’s team:
1. Leveling and calibration of the chuck X/Y/Z/Theta stage
2. Disassembly and installation of the chuck
22 Eoulu high performance thermal Chuck

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