| F1 Mechanical Performance | |||||||||
| No. | Item | Chuck | |||||||
| X-axis | Y-axis | Z-axis | Theta axis | ||||||
| 1 | Travel | 301 mm | 301 mm | ≥ 10 mm | 10° | ||||
| 2 | Maximum positioning accuracy | ≤ 0.05 μm | ≤ 0.05 μm | ≤ 1 μm | ± 0.003° | ||||
| 3 | Speed | ≥ 50 mm/s | ≥ 50 mm/s | ≥ 20 mm/s | / | ||||
| 4 | Maximum speed | 150 mm/s | 150 mm/s | 35 mm/s | / | ||||
| 5 | Wafer roughness adaptability | 100 μm | |||||||
| 6 | Average time of mapping | Minimum value | Typical value | Maximum value | |||||
| < 500 ms | < 1 s | < 3 s | |||||||
| 7 | XY position locking | Minimum value | Typical value | Maximum value | |||||
| 0.02 μm | 0.038 μm | 1.5 μm | |||||||
| 8 | Z position locking | Minimum value | Typical value | Maximum value | |||||
| 0.65 μm | 3.5 μm | 15 μm | |||||||
| F1 Shielding Capability | |||||||||
| No. | Shielding and Noise Capability | ||||||||
| 1 | Light attenuation | ≥ 150 dB | |||||||
| 2 | EMI shielding | ≥ 20 dB 0.5~20 GHz (typical) | |||||||
| 3 | Spectral noise floor | ≤ -150 dBVrms/rtHz (≤ 1 MHz) | |||||||
| 4 | System AC noise | ≤ 15 mVp-p (≤ 1 GHz) | |||||||
| 5 |
|
||||||||
| F1 Vibration Isolation Capability | |||||
| No. | Vibration Isolation Capability | ||||
| 1 | Natural frequency (vertical) | 2.5 ~ 2.7 Hz | |||
| 2 | Natural frequency (horizontale) | 2.0 ~ 4.5 Hz | |||
| 3 | Vertical damping (adjustable) | 6% ~ 20% | |||
| 4 | Horizontal damping | 5% ~ 6% | |||
| 5 | Air pressure | 0.3 ~ 0.5 Mpa | |||
| 6 | Maximum load | 1600 kg | |||
| 7 | Isolation efficiency | 5% ~ 6% | |||
| 8 | Response time to external excitation | < 1 s | |||
| 9 | Vibration isolation level | VC-C | |||
| F1 Microscope | |||||
| Microscope Bridge | |||||
| No. | Item | X-axis | Y-axis | Z-axis | / |
| 1 | Travel | 50 mm | 50 mm | 90 mm | / |
| 2 | Maximum positioning accuracy | ± 2 μm | ± 2 μm | ± 2 μm | / |
| 3 | Speed | 60 mm/s | 60 mm/s | 120 mm/s | / |
| Microscope | |||||
| No. | Item | Large FOV | High Resolution | ||
| 4 | Typical magnification | 225 X | 500 ~ 2000X or higher | ||
| 5 | Typical optical lens resolution | 3.0 μm | ≤ 1.5 μm | ||
| 6 | Product picture | ![]() |
![]() |
||
| 7 | futureI image | ![]() |
![]() |
||
| F1 Chuck | |||||
| No. | Item | Chuck size | |||
| 8-inch | 12-inch | ||||
| 1 | Temperature range | Room temperature | High and low temperature | Room temperature | High and low temperature |
| 2 | Maximum operating temperature range | – | -60 ~ 300°C | – | -60 ~ 300°C |
| 3 | Typical temperature range | – | – 60 ~ 150°C – 60 ~ 200°C – 60 ~ 300°C – 40 ~ 150°C -40 ~ 200°C -40 ~ 300°C 0 ~ 100°C 0 ~ 200°C Room temperature ~ 150°C Room temperature ~ 200°C Room temperature ~ 300°C |
– | – 60 ~ 150°C – 60 ~ 200°C – 60 ~ 300°C – 40 ~ 150°C -40 ~ 200°C -40 ~ 300°C 0 ~ 100°C 0 ~ 200°C Room temperature ~ 150°C Room temperature ~ 200°C Room temperature ~ 300°C |
| 4 | Temperature accuracy | 8-inch | 12-inch | ||
| 5 | Temperature resolution | ± 1°C | ± 1°C | ||
| 6 | Triax chuck leakage (non-thermal) | 0.1°C | 0.1°C | ||
| 7 | Triax chuck noise (non-thermal) | ≤ 132 fA | ≤ 231 fA | ||
| 8 | Cooling mode | ≤ 30 fA | ≤ 42 fA | ||
| 9 | Typical transition time (Liquid cool) |
– 60°C → 25°C:23 min 25°C → 300°C:28 min 300°C → 25°C:25 min 25°C → -60°C:37 min |
– 60°C → 25°C:23 min 25°C → 300°C:28 min 300°C → 25°C:25 min 25°C → -60°C:37 min |
||
| 10 | Typical transition time (Air cool) |
– 60°C → 25°C:9 min 25°C → 300°C:25 min 300°C → 25°C:12 min 25°C → -60°C:29 min |
– 60°C → 25°C:9 min 25°C → 300°C:25 min 300°C → 25°C:12 min 25°C → -60°C:29 min |
||
| 11 | Maximum heating power | 5.5 kW | |||
| 12 | Maximum cooling power | 12.5 kW | |||
| 13 | Maximum refrigerant flow | 5 m/s | |||
| 14 | Maximum transport pressure | 4 bar | |||
| 15 | Maximum voltage (high power option) | 10000 V | |||
| 16 | Maximum current (high power option) | 800 A | |||
| 17 | Usage statement | l It shall be operated and stored strictly in accordance with the temperature and humidity specified in “Environmental conditions” in this Manual. l Before the probe station leaves the factory, wafers shall be placed on chuck for performance verification and reliability test. Therefore, the scratches on the surface of chuck or the movable plate cannot be completely avoided. The scratches do not affect the use of the probe station and are not considered as a quality problem. l Before the thermal probe station leaves the factory, heating and cooling test shall be conducted on the thermal system and thermal chuck. Therefore, the baking marks on the surface of the chuck (e.g. chuck color change and water vapor mark) cannot be completely avoided. The baking marks do not affect the use of the equipment and are not considered as a quality problem. l When ambient temperature fluctuations occur, thermal expansion and contraction of equipment hardware constitutes a normal operational phenomenon. l To ensure the reliability and consistency of test results, if the probe station remains continuously powered on and idle for 24 hours or longer, the user must perform system recalibration and reinitialize parameter settings. l For high-precision, extended-duration (>6h) metrology of individual wafer, implementation of the Eoulu software application kit with associated service package is recommended. l If ESD (Electrostatic Discharge) protection is required for the equipment, please explicitly state this before procurement. The F1 Probe Station provides ESD protection for key modules (Chuck, Robotic arm ). However, please note that ESD protection cannot be guaranteed for all components of the equipment. Certain materials and structures cannot achieve ESD protection through conventional processes. Forced modifications may lead to performance degradation, reduced service life, or significantly increased costs. Any equipment malfunctions resulting from such modifications will not be covered under the product warranty. |
|||
| 18 | Safety statement | This product is driven by 24 V DC motor, with an operating voltage level comparable to that of a personal computer (PC). It complies with the specifications for SELV (Safety Extra-Low Voltage) circuits as defined in IEC 61010-1 and meets the protection class against electric shock for Class III equipment as specified in IEC 61140. Based on this design, the Emergency Stop Device (EMO) or Electromagnetic Braking System (EMS) does not provide additional safety benefits. Note: This statement does not affect other mechanical safety requirements that the equipment shall meet. |
|||
| 19 | Cleaning | l No items can be placed on the chuck except the device under test. l If the screws are loose, promptly tighten them carefully and evenly according to the torque requirements. If necessary, contact the Eoulu’s after-sales team for treatment. l For the fully-automated probe station, ensure that the power supply has been properly shut down during maintenance or when not in use, and ensure they do not accidentally restart before maintenance is completed or before use. |
|||
| 20 | Maintenance | l For probe station with a high utilization rate, it is recommended to conduct operational inspection and service of the chuck once a year. l The following services can only be executed by Eoulu’s team: 1. Leveling and calibration of the chuck X/Y/Z/Theta stage 2. Disassembly and installation of the chuck |
|||
| 21 | Service | l For probe station with a high utilization rate, it is recommended to conduct operational inspection and service of the chuck once a year. l The following services can only be executed by Eoulu’s team: 1. Leveling and calibration of the chuck X/Y/Z/Theta stage 2. Disassembly and installation of the chuck |
|||
| 22 | Eoulu high performance thermal Chuck | ![]() |
![]() |
||
문의사항은 월요일-금요일(주 5일) 기술지원팀으로 문의주십시오.
031-360-4282
기술 지원, 판매 연락 또는 제품 견적 요청 atm@atminc.co.kr