키사이트 공식대리점

F1 – SiPh 프로브 스테이션

F1 – SiPh 프로브 스테이션

  • 6,8,12인치 / 수동, 반자동, 전자동
  • F1+futureC+instrument를 선택구성
  • 1m 폭, 클린룸 비용을 절감, 이동편리
  • 실리콘 포토닉스 측정 가능
  • OO, OE, EO 및 EE테스트 지원
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주요특징

F1 – SiPh 프로브 스테이션

  • F1프로브스테이션의 핵심은 Future C 소프트웨이며 이 소프트웨어
  • 열 시스템을 통해 가변 온도를 구현
  • SiPh AutoCal 보정 소프트웨어 알고리즘을 통해 신속한 위보정
  • 오픈형 시스템이 아닌 마이크로챔버 시스템
  • 누설전류(Leakage current) 및 노이즈 테스트에서 더 우수한 성능을 제공.
  • 세미오토(Semi-Auto)스테이션과 온도제어기능이 포함된 스테이션으로 업그레이드 가능
제품사양

F1 – SiPh 프로브 스테이션

F1 Mechanical Performance
No. Item Chuck
X-axis Y-axis Z-axis Theta axis
1 Travel 301 mm 301 mm ≥ 10 mm 10°
2 Maximum positioning accuracy ≤ 0.05 μm ≤ 0.05 μm ≤ 1 μm ± 0.003°
3 Speed ≥ 50 mm/s ≥ 50 mm/s ≥ 20 mm/s /
4 Maximum speed 150 mm/s 150 mm/s 35 mm/s /
5 Wafer roughness adaptability 100 μm
6 Average time of mapping Minimum value Typical value Maximum value
< 500 ms < 1 s < 3 s ****
7 XY position locking Minimum value Typical value Maximum value
0.02 μm 0.038 μm 1.5 μm
8 Z position locking Minimum value Typical value Maximum value
0.65 μm 3.5 μm 15 μm
F1 Shielding Capability
No. Shielding and Noise Capability *
1 Light attenuation ≥ 150 dB **
2 EMI shielding ≥ 20 dB 0.5~20 GHz (typical)
3 Spectral noise floor ≤ -150 dBVrms/rtHz (≤ 1 MHz)
4 System AC noise ≤ 15 mVp-p (≤ 1 GHz)

 

F1 Microscope
Microscope Bridge
No. Item X-axis Y-axis Z-axis /
1 Travel 50 mm 50 mm 90 mm /
2 Maximum positioning accuracy ± 2 μm ± 2 μm ± 2 μm /
3 Speed 60 mm/s 60 mm/s 120 mm/s /
Microscope
No. Item Large FOV High Resolution
4 Typical magnification 225 X 500 ~ 2000X or higher
5 Typical optical lens resolution 3.0 μm ≤ 1.5 μm
6 Product picture 　
7 futureI image 　
F1 Chuck
No. Item Chuck size
8-inch 12-inch
1 Temperature range Room temperature High and low temperature Room temperature High and low temperature
2 Maximum operating temperature range – -60 ~ 300°C – -60 ~ 300°C
3 Typical temperature range – – 60 ~ 150°C
– 60 ~ 200°C
– 60 ~ 300°C
– 40 ~ 150°C
-40 ~ 200°C
-40 ~ 300°C
0 ~ 100°C
0 ~ 200°C
Room temperature ~ 150°C Room temperature ~ 200°C Room temperature ~ 300°C		 – – 60 ~ 150°C
– 60 ~ 200°C
– 60 ~ 300°C
– 40 ~ 150°C
-40 ~ 200°C
-40 ~ 300°C
0 ~ 100°C
0 ~ 200°C
Room temperature ~ 150°C Room temperature ~ 200°C Room temperature ~ 300°C
4 Temperature accuracy ± 1°C ± 1°C
5 Temperature resolution 0.1°C 0.1°C
6 Triax chuck leakage (non-thermal) ≤ 132 fA ≤ 231 fA
7 Triax chuck noise (non-thermal) ≤ 30 fA ≤ 42 fA
8 Cooling mode Liquid cool and air cool are optional
9 Typical transition time
(Liquid cool)		 – 60°C → 25°C：23 min
25°C → 300°C：28 min
300°C → 25°C：25 min
25°C → -60°C：37 min		 – 60°C → 25°C：23 min
25°C → 300°C：28 min
300°C → 25°C：25 min
25°C → -60°C：37 min
10 Typical transition time
(Air cool)		 – 60°C → 25°C：9 min
25°C → 300°C：25 min
300°C → 25°C：12 min
25°C → -60°C：29 min		 – 60°C → 25°C：9 min
25°C → 300°C：25 min
300°C → 25°C：12 min
25°C → -60°C：29 min
11 Maximum heating power 5.5 kW
12 Maximum cooling power 12.5 kW
13 Maximum refrigerant flow 5 m/s
14 Maximum transport pressure 4 bar
15 Maximum voltage (high power option) 10000 V
16 Maximum current (high power option) 800 A
17 Statement l It shall be operated and stored strictly in accordance with the temperature and humidity specified in “Environmental conditions” in this Manual.
l Before the probe station leaves the factory, wafers shall be placed on chuck for performance verification and reliability test. Therefore, the scratches on the surface of chuck or the movable plate cannot be completely avoided. The scratches do not affect the use of the probe station and are not considered as a quality problem.
l Before the thermal probe station leaves the factory, heating and cooling test shall be conducted on the thermal system and thermal chuck. Therefore, the baking marks on the surface of the chuck (e.g. chuck color change and water vapor mark) cannot be completely avoided. The baking marks do not affect the use of the equipment and are not considered as a quality problem.
18 Cleaning l Clean the probe station once a month. Use a soft dust-free cloth to remove the dirt from chuck. If lots of dust and debris are generated during use, the cleaning frequency shall be increased.
l Do not use isopropyl alcohol(IPA) or any other chemicals on the chuck, as improper use of solvents or grinding agents may damage the probe station.
19 Maintenance l No items can be placed on the chuck except the device under test.
l If the screws are loose, promptly tighten them carefully and evenly according to the torque requirements. If necessary, contact the Eoulu’s after-sales team for treatment.
l For the fully-automated probe station, ensure that the power supply has been properly shut down during maintenance or when not in use, and ensure they do not accidentally restart before maintenance is completed or before use.
20 Service l For probe station with a high utilization rate, it is recommended to conduct operational inspection and service of the chuck once a year.
l The following services can only be executed by Eoulu’s team:
1. Leveling and calibration of the chuck X/Y/Z/Theta stage
2. Disassembly and installation of the chuck
22 Eoulu high performance thermal Chuck 　

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